Fastening and Joining Research Institute  The objective of this institute is to enhance the reliability and safety of metallic, composite and polymeric joints by advancing the science and technology of mechanical fastening, adhesive bonding, welding and riveting. The institute is a one-of-a-kind facility that pursues fundamental and applied research to develop and disseminate new technologies for the fastening and joining of metals, composites and polymers. The Institute develops and disseminates novel advanced technologies in the areas of automated assembly of bolted joints, adhesive bonding of composites, resistance welding and riveting, a niche area that significantly impacts the safety and reliability of many products. |
Veneer-based product and method of manufacture & Carbon in wood products  A rate limiting step in the production of veneer-based wood products or pressed wood composites is the time required to transfer heat through the product being pressed. This technology increases the thermal conductivity of composite wood materials thereby reducing the required press time to produce acceptable mechanical properties. This technology has been demonstrated for wood veneer products (“plywood”) and oriented strandboard but could apply to other composite materials where enhanced thermal conductivity is desired. |
Environment-induced Embrittlement of Intermetallic Alloys Several intermetallics are extremely susceptible to embrittlement by water vapor; among these are the iron aluminides, alloys which otherwise have considerable promise as structural materials because of their low density, high resistance to corrosion and oxidation, and low cost. It is suspected that for these materials hydrogen embrittlement results from the reaction of the alloy surface with water vapor. This program of research incorporates measurements of fracture toughness and sub-critical crack growth under controlled chemical and electrochemical conditions to gain information about the kinetics of embrittlement. Structural characterization includes transmission electron microscopy. |
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